Name:
ECIA EIA/ECA-364-56D PDF
Published Date:
02/28/2008
Status:
[ Revised ]
Publisher:
Electronic Components Industry Association
This standard establishes a test method for determining whether connectors can withstand the effects of the heating and/or environment that they will be subjected to during the soldering of their terminations by solder dip, soldering iron, solder wave, or reflow soldering techniques.
Object
The heat and/or environment of soldering may affect the electrical characteristics of the connector and may cause damage to the materials making up the connector. It may also result in loosening of terminations, softening or distortion of insulation materials, opening of solder seals, weakening of mechanical joints, etc.
| ANSI : | ANSI Approved |
| Edition : | D |
| File Size : | 0 files |
| Number of Pages : | 20 |
| Published : | 02/28/2008 |