Name:
ECIA EIA/ECA-364-56C PDF
Published Date:
08/01/2006
Status:
[ Revised ]
Publisher:
Electronic Components Industry Association
This standard establishes a test method for determining whether connectors can withstand the effects of the heating and/or environment that they will be subjected to during the soldering of their terminations by solder dip, soldering iron, solder wave, or reflow soldering techniques.
| ANSI : | ANSI Approved |
| Edition : | C |
| File Size : | 0 files |
| Number of Pages : | 20 |
| Published : | 08/01/2006 |