Name:
ECIA EIA-364-56E PDF
Published Date:
11/01/2011
Status:
[ Revised ]
Publisher:
Electronic Components Industry Association
This standard establishes a test method for determining if connectors or sockets can withstand exposure to soldering conditions either by soldering iron, solder dip, solder wave, or reflow soldering techniques.
| ANSI : | ANSI Approved |
| Edition : | E |
| File Size : | 0 files |
| Number of Pages : | 20 |
| Published : | 11/01/2011 |