IEC 60191-6-16 Ed. 1.0 b:2007 PDF

Published Date: 04/26/2007

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

Published Date: 04/26/2007

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

Published Date: 12/22/1998

Twentieth supplement

Published Date: 06/11/2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Published Date: 08/07/2003

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Published Date: 07/11/2003

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Published Date: 12/01/1988

Data Interchange on 90mm Flexible Disk Cartridges Using MFM Recording at 7 958 ftprad on 80 Tracks on Each Side-ISO Type 301, Second Edition

Published Date: 07/01/1987

Rate Adaptation for the Support of Synchronous and Asynchronous Equipment Using the V. Series Type Interface on a PCSN, Second Edition

Published Date: 12/01/1993

PTN - Signaling Protocol at the S Reference Point - Circuit Mode Basic Services (SSIG-BC), Third Edition

Published Date: 06/01/1995

Volume and File Structure of Disk Cartridges for Information Interchange, Second Edition

Published Date: 12/01/1996

Measurement of High-frequency Noise emitted by Information Technology and Telecommunications Equipment, Third Edition

Published Date: 12/01/1996

Declared Noise Emission Values of Information Technology and Telecommunications Equipment