JEDEC JESD51-4A PDF

JEDEC JESD51-4A PDF

Name:
JEDEC JESD51-4A PDF

Published Date:
06/01/2019

Status:
Active

Description:

Thermal Test Chip Guideline (Wire Bond Type Chip)

Publisher:
JEDEC Solid State Technology Association

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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Choose Document Language:
$20.1
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The purpose of this document is to provide a design guideline for thermal test chips used for integrated circuit (IC) and transistor package thermal characterization and investigations. The intent of this guideline is to minimize the differences in data gathered due to nonstandard test chips and to provide a well-defined reference for thermal investigations.
File Size : 1 file , 1.2 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 26
Published : 06/01/2019
Redline File Size : 2 files , 5.8 MB

History

JEDEC JESD51-4A
Published Date: 06/01/2019
Thermal Test Chip Guideline (Wire Bond Type Chip)
$20.1
JEDEC JESD51-4
Published Date: 02/01/1997
THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)
$16.8

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